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Thin wafer dicing using a high repetition rate femtosecond laser

thesis

posted on 2021-05-23, 11:31 authored by Nitinkumar Sudani

Thin wafer dicing using a high repetition rate femtosecond laser

History

Language

eng

Degree

Master of Applied Science

Program

Mechanical and Industrial Engineering

Granting Institution

Ryerson University

LAC Thesis Type

Thesis

Thesis Advisor

Krishnan Venkatakrishnan Bo Tan

Usage metrics

Mechanical and Industrial Engineering (Theses)

Categories

Uncategorized content

Keywords

Femtosecond lasers -- Industrial applications Semiconductor wafers -- Design and construction Semiconductor industry -- Laser use in Microelectronics Manufacturing processes

Licence

Exports