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Thin wafer dicing using a high repetition rate femtosecond laser

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posted on 2021-05-23, 11:31 authored by Nitinkumar Sudani
Thin wafer dicing using a high repetition rate femtosecond laser

History

Language

English

Degree

  • Master of Applied Science

Program

  • Mechanical and Industrial Engineering

Granting Institution

Ryerson University

LAC Thesis Type

  • Thesis

Thesis Advisor

Krishnan Venkatakrishnan Bo Tan

Year

2009

Usage metrics

    Mechanical and Industrial Engineering (Theses)

    Categories

    Keywords

    Femtosecond lasers -- Industrial applicationsSemiconductor wafers -- Design and constructionSemiconductor industry -- Laser use inMicroelectronicsManufacturing processes

    Licence

    In Copyright

    Exports

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